Mercury Systems Ships Defense Industry’s First BuiltSecure DDR4 High Density Secure Memory Device
Delivering space savings of 75% compared to discrete memory devices, Mercury’s three-dimensional packaging technology transforms a planar array of nine discrete DDR4 devices into a single, SWaP-efficient and vertically integrated BuiltSecure device delivering DDR4 performance over an extended operating temperature range of -55 to +125 °C. With a height less than 2.5 millimeters, the new devices are ideally suited for placement on the backside of a printed circuit board, thereby freeing valuable real estate on the front side of the board for placement of additional active and passive components needed to further enhance system performance.
“After announcing our DDR4 design program in March of this year, we received a tremendous response from defense prime contractors in need of highly miniaturized and ruggedized DDR4 memory solutions with data transfer rates up to 2666 MB/s,” said
Mercury’s entire portfolio of BuiltSecure high density secure memory devices are designed and manufactured in its Defense Microelectronics Activity (
For application assistance, more information on Mercury’s BuiltSecure DDR4 high density secure memory devices or to participate in Mercury’s design program, visit www.mrcy.com/ddr4 or contact Mercury at (866) 627-6951 or firstname.lastname@example.org.
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Source: Mercury Systems Inc